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0.2MM Plating Edge Enig For Multilayer Flexible Printed Circuit Board

Categories Multilayer Printed Circuit Board
Brand Name: Found
Model Number: fd08
Certification: UL E361831 ISO9001 TS16949
Place of Origin: China
Price: Negotiable
Payment Terms: T/T
Supply Ability: 100000PC
Packaging Details: vacuum packing
Delivery Time: 2-8 days
Board thickness: 0.2-6.0mm
Copper thickness: 0.5oz-6oz
Base material: FR-4/aluminum/ceramic
Min. line spacing: 0.003"
Min. line width: 0.1mm/4mi
Min. hole size: 0.15-0.2mm
Surface finishing: ENIG
Product name: Shenzhen Custom Multilayer pcb printed circuit board
Solder mask color: Blue.green.red.black.white.etc
Application: Consumer Electronics
Solder mask: Green. Red. Blue. White. Black.Yellow
Name: 94v0 Multilayer PCB Boards Printing Circuit Board
Number of layers: 6-Layer
Service: One Stop Turnkey Service
Layers: 1-6layers
Usage: OEM Electronics
Item: Custom Circuit Board
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0.2MM Plating Edge Enig For Multilayer Flexible Printed Circuit Board

0.2MM Plating Edge Enig For Multilayer Flexible Printed Circuit Board ​

  • Product Description Specification: Layer 4 Material FR4 Board Thickness 1.6mm Copper Thickness 1oz Solder Mask Green Silkscreen White Surface Finish HASL Model NO.: RCT-Rigid flex pcb Solder Mask: Green Silkscreen: White Surface Treatment: Immersion Gold Other Specification: HDI PCB Origin:...
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Product Description
Board Thickness1.6mm
Copper Thickness1oz
Solder MaskGreen
Surface FinishHASL

Model NO.: RCT-Rigid flex pcb Solder
Mask: Green
Silkscreen: White
Surface Treatment: Immersion Gold
Other Specification: HDI PCB
Origin: China
HS Code: 85340010

Rigid Flex PCB boards are composed of a combination of rigid and flexible printed circuit boards that are connected to one another by lamination. so most of the rigid flex PCB are made of multiple layers of flexible circuit substrates attached to one or more layer rigid boards internally or externally, depending upon your design requirements
At present rigid flex PCB is applied in more and more applications, as it can offers optimum solutions for limited installation space conditions. and also rigid flex PCB can provide the possibility of secure and high electrical connection performance of the device components with the assurance of contact stability, as well as a reduction in plug and connector components.

RCT own excellent rigid flex PCB manufacturing technologies, our experts have been focus on the research of rigid flex PCB production for many years, and are the owner of 20+ innovative patents, our rigid flex PCB products are featured with the high quality, reliability and also competitive cost, so we are the leading rigid flex PCB supplier in China, now we can make ultra thin 0.25mm 4 Layers Rigid Flex PCB and up to 24 Layer Rigid Flex PCB.

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PCB DescriptionOur PCB Board Capability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size1200mm×600mm
PCB Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
PCB Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
Outline ToleranceRouting:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD TypeSingle-sided, double-sided, multi-layer
Major MaterialFR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness0.2-3.5mm
Base Copper Thickness11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
Min trace/space(inner/external)3/3 mil0.075/0.075mm
Min drill size for through holedrill 8.0 mil0.20mm
Laser dill4 mil0.1mm
Copper Foil Thickness17-210um
Inner Core Thickness±0.08mm
Tolerance of total board thickness±0.015mm
Max .Unit Area700-800
Min. Unit Area2-5mm
Max Layer1-18 Layers
Surface Treatment
Solder Coating Thickness Sn4-20um
Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um
Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um
OSP Coating Thickness0.2-0.5um
Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm
Chem .Tin ThicknessSn:0.8-5um
Producting Capacityeach day :800-100m2
Aspect Ratio6:01:00
Hole Registration0.004" (0.1mm)

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

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