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Immersion Gold Silver HDI PCB electronic printed circuit board

Categories Multilayer Printed Circuit Board
Brand Name: Found
Model Number: Found124
Certification: UL:E361831
Place of Origin: China
MOQ: 1PC
Price: Negotiatable
Payment Terms: T/T
Supply Ability: 100000PC
Delivery Time: 2-8 days
Packaging Details: Vacuum packing
Board thickness: 1.6mm, 0.2-6.0mm, 0.5~3.2mm, 1.6mm-3.2mm, 0.4~3mm
Copper thickness: 1oz, 0.5oz-6oz, 1/2OZ 1OZ 2OZ 3OZ, 1 0Z /35um, 1/2/3/4/5 oz
Base material: FR-4, CEM-1, FR-4/aluminum/ceramic, FR-4/aluminum/ceramic/cem-3/FR-1, Aluminum
Application: Electronics Device, Consumer Electronics, pcb printed circuit board, engineering testing
Solder mask: Green. Red. Blue. White. Black.Yellow, Blue, green, Yellow, Customised
Service: One Stop Turnkey Service, One-stop Service, PCB/Components Sourcing/Soldering/Programming/Testing.., PCB&PCBA
Layers: 1~28, 1-6layers
Usage: OEM Electronics, for cellphone battery, Car Audio Etc
Material: FR4/ROGERS/PET/HDI/CEM/PI, FR4 Hight TG, FR4 /aluminum/ceramic CEM1
Item: DHL UPS EMS FEXDEX, Custom Circuit Board, 2 Layer Pcb, Multilayer PCB Board
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Immersion Gold Silver HDI PCB electronic printed circuit board

Immersion Gold Silver HDI PCB electronic printed circuit board

Min. Order:

1 Piece

Port:

Shenzhen, China

Transport Package:

by Vacuum Packing in Cartons

Payment Terms:

L/C, T/T, D/P, Western Union, Paypal, Money Gram


Type:

Rigid Circuit Board

Dielectric:

FR-4

Material:

Fiberglass Epoxy

Flame Retardant Properties:

V0

Mechanical Rigid:

Rigid

Processing Technology:

HASL Lf, Plating. Gold, Immersion Gold, Silver,


Technology
Min trace/space(inner/external)3/3 mil0.075/0.075mm
Min drill size for through holedrill 8.0 mil0.20mm
Laser dill4 mil0.1mm
Copper Foil Thickness17-210um
Inner Core Thickness±0.08mm
Tolerance of total board thickness±0.015mm
Max .Unit Area700-800
Min. Unit Area2-5mm
Max Layer1-18 Layers
Surface Treatment
Solder Coating Thickness Sn4-20um
Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um
Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um
OSP Coating Thickness0.2-0.5um
Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm
Chem .Tin ThicknessSn:0.8-5um
Producting Capacityeach day :800-100m2
Aspect Ratio6:01:00
Hole Registration0.004" (0.1mm)


Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS


Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement


Product Description

Standard Flex Materials:

Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)


Base Copper:
1/3 oz. - .00047 in. (.012mm)--rarely used
1/2 oz. - .0007 in. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)
Solder Mask:
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm)
with 0.5 to 2 mil Adhesive (.012mm - .051mm)
LPI and LDI Flexible Soldermasks


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