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Immersion Silver PCB Chamfering Gold Finger PCB building a circuit board

Categories Multilayer Printed Circuit Board
Brand Name: Found
Model Number: Found133
Certification: UL:E361831
Place of Origin: China
MOQ: 1PC
Price: Negotiatable
Payment Terms: T/T
Supply Ability: 100000PC
Delivery Time: 2-8 days
Packaging Details: Vacuum packing
Board thickness: 1.6mm, 0.2-6.0mm, 0.5~3.2mm, 1.6mm-3.2mm, 0.4~3mm
Base material: FR-4, CEM-1, FR-4/aluminum/ceramic, FR-4/aluminum/ceramic/cem-3/FR-1, Aluminum
Application: Electronics Device, Consumer Electronics, pcb printed circuit board, engineering testing
Solder mask: Green. Red. Blue. White. Black.Yellow, Blue, green, Yellow, Customised
Service: One Stop Turnkey Service, One-stop Service, PCB/Components Sourcing/Soldering/Programming/Testing.., PCB&PCBA
Layers: 1~28, 1-6layers
Usage: OEM Electronics, for cellphone battery, Car Audio Etc
Material: FR4/ROGERS/PET/HDI/CEM/PI, FR4 Hight TG, FR4 /aluminum/ceramic CEM1
Item: DHL UPS EMS FEXDEX, Custom Circuit Board, 2 Layer Pcb, Multilayer PCB Board
Min. hole size: 0.2mm, 8 mil/6 mil, 0.15-0.2mm, 0.075mm(3mil)
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Immersion Silver PCB Chamfering Gold Finger PCB building a circuit board

Immersion Silver PCB Chamfering Gold Finger PCB building a circuit board
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax600*1000mm (24"x40")
Min30x50mm
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical)0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288 degrees centigrade & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, B

Technology
Min trace/space(inner/external)3/3 mil0.075/0.075mm
Min drill size for through holedrill 8.0 mil0.20mm
Laser dill4 mil0.1mm
Copper Foil Thickness17-210um
Inner Core Thickness±0.08mm
Tolerance of total board thickness±0.015mm
Max .Unit Area700-800
Min. Unit Area2-5mm
Max Layer1-18 Layers
Surface Treatment
Solder Coating Thickness Sn4-20um
Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um
Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um
OSP Coating Thickness0.2-0.5um
Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm
Chem .Tin ThicknessSn:0.8-5um
Producting Capacityeach day :800-100m2
Aspect Ratio6:01:00
Hole Registration0.004" (0.1mm)


Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS


Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement


PCBA Capability

SMT, PTH, mixed technology

SMT: 2,000,000 solder joints per day

DIP: 300,000 joints per day

Ultra fine pitch, QFP, BGA, BGA, CBGA

Advanced SMT assembly

Automated insertion of PTH (axial, radial, dip)

Cleanable, aqueous and lead-free processing

RF manufacturing expertise

Peripheral process capabilities

Pressfit back planes & mid planes

Device programming

Automated conformal coating

We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

immersion silver


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