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Rigid Flexible Rigid PCB 1OZ Thickness Electric Gold ENIG Surface Finishing

Categories Flexible Rigid PCB
Brand Name: military radar system backplane
Model Number: 100L soft and hard combination
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Payment Terms: L/C, T/T, Western Union
Supply Ability: 5-200K/pcs per month
Delivery Time: 55-60day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Board thickness: 0.2-6.0mm
Copper thickness: 1oz
Base material: FR-4/aluminum/ceramic
Min. line spacing: 4mil
Min. line width: 0.1mm/4mi
Surface finishing: ENIG
Product name: Shenzhen Custom Multilayer pcb printed circuit board,OEM multilayer 94v0 bare printed circuit board
Name: 94v0 Multilayer PCB Boards Printing Circuit Board
Layers: 1~28
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Rigid Flexible Rigid PCB 1OZ Thickness Electric Gold ENIG Surface Finishing

100layers soft and hard combination Flexible Rigid PCB rigid flex pcb manufacturers,rigid flex board,rigid flex pcb


Product Description


  1. Precision V-cut or routing for panel form design
  2. OEM orders for SMT and A/I assembly projects accepted
  3. Gerber file preferred
  4. Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotations
  5. We will offer our best prices if you can send your own PCB design

Product Details

  1. 100layers soft and hard combination Flexible Rigid PCB rigid flex pcb manufacturers,rigid flex board,rigid flex pcb
  2. Product area: military radar system backplane
  3. Number of layers: 100L soft and hard combination
  4. Plate thickness 5.60mm ± 10%;
  5. Process structure: DuPont + FR-4TG170, minimum hole 0.50mm, copper
  6. thickness 1OZ, line width line spacing 4/4mil, impedance ± 10% Ω,
  7. Surface treatment: electric gold 2u"
  8. Packing: vacuum packaging + humidity card + moisture-proof beads + carton

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supply

NOsupplierSupply material nameMaterial origin
1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
4SanTiePI, covering membraneJapan
5Born goodFR-4,PI,PP,Copper berthshenzhen, China
6A rainbowPI, covering membrane,Copper berthTaiwan
7teflonHigh frequency materialsThe United States
8RogersHigh frequency materialsThe United States
9Nippon SteelPI, covering membrane,Copper berthTaiwan
10sanyoPI, covering membrane,Copper berthJapan
11South AsiaFR-4,PI,PP,Copper berthTaiwan
12doosanFR-4,PPSouth Korea
13Tai Yao plateFR-4,PP,Copper berthTaiwan
14AlightFR-4,PP,Copper berthTaiwan
15YaoguangFR-4,PP,Copper berthTaiwan
16YalongFR-4,PPThe United States
17ISOALFR-4,PPJapan
18OAKBuried, buried resistance, PPJapan
19United States 3MFR-4,PPThe United States
20BergsCopper and aluminum matrixJapan
21The suninkTaiwan
22MuratainkJapan
23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
24YasenPPI, covering membraneChina jiangsu
25Yong Sheng TaiinkChina guangdong panyu
26mitainkJapan
27Transcriptceramic materialTaiwan
28HOMEceramic materialJapan
29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray:


PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products


FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.



Precision V-cut or routing for panel form design
OEM orders for SMT and A/I assembly projects accepted
Gerber file preferred
Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotations
We will offer our best prices if you can send your own PCB design

Quality Rigid Flexible Rigid PCB 1OZ Thickness Electric Gold ENIG Surface Finishing for sale
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