Product Process Capability Parameters Form
|Item||Mass production||Small batch production|
|Number of Layers||UP TO 32L||UP TO 32L|
|Laminate Type||FR-4, Halogen free, High TG(Shengyi, Jiantao), Cem-3, PTFE,
Aluminum based, PTEE, Rogers etc.||FR-4, Halogen free, High TG(Shengyi, Jiantao), Cem-3, PTFE,
Aluminum based, PTEE, Rogers etc.|
|Maximum board size||610mm*1100mm||610mm*1100mm|
|Board thickness||0.1mm-7.00mm||＜0.1mm and ＞7.00mm|
|Minimum line width/space||3.5mil(0.0875mm)||3mil(0.075mm)|
|Minimum line gap||+/-15%||+/-10%|
|Outer layer copper thickness||35um-175um||35um-210um|
|Inner layer copper thickness||12um-175um||12um-210um|
|Drilling hole size(Mechanical)||0.15mm-6.5mm||0.15mm-6.5mm|
|Finished hole size (Mechanical)||0.15mm-6.0mm||0.15mm-6.0mm|
|Board thickness hole size ratio||14:1||16:1|
|Board thickness tolerance(t=0.8mm)||±8%||±5%|
|Board thickness tolerance(t＜0.8mm)||±10%||±8%|
|Min. grid line width||4mil(12, 18, 35um), 6mil(70um)||4mil(12, 18, 35um), 6mil(70um)|
|Min. grid spacing||6mil(12, 18, 35um), 8mil(70um)||6mil(12, 18, 35um), 8mil(70um)|
|Hole size tolerance(Mechanical)||0.05-0.075mm||0.05mm|
|Hole position tolerance(Mechanical)||0.005mm||0.005mm|
|Solder Mask Color||Green, Blue, Black, White, Yellow, Red, Grey etc.||Green, Blue, Black, White, Yellow, Red, Grey etc.|
|Impedance control Tolerance||+/-10%||+/-8%|
|Min. distance between drilling to conductor(non-blind buried
orifice)||8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)||6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)|
|Min. distance between drilling to conductor(blind buried orifice)||8mil(once lamination by the ordinary rules), 10mil(twice
lamination), 12mil(thrice lamination)||8mil(once lamination by the ordinary rules), 10mil(twice
lamination), 12mil(thrice lamination)|
|Milling(edge) depth control or a blind slot precision(NPTH)||±0.1mm||±0.1mm|
|Min. Character width and height(12, 18um base copper)||Line width: 4.5mil; height: 23mil||Line width: 4.5mil; height: 23mil|
|Min. Character width and height(35um base copper)||Line width: 5mil; height: 27mil||Line width: 5mil; height: 27mil|
|Max. test voltage||500V||500V|
|Max. test current||200mA||200mA|
|Hard Gold Plating||0.375um<X<1.75um||>=1.75um|
|V-Cut rest thickness tolerance||±0.1mm||±0.1mm|
|Chamfer||The angle type of the chamfer||30,45,60|
|Plug via hole||Max.size can be plugged||0.6mm|
|Largest NPTH hole size||6.5mm||>6.5mm|
|Largest PTH hole size||6.5mm||>6.5mm|
|Min. solder spacer ring||0.05mm||0.05mm|
|Min. solder bridge width||0.1mm||0.1mm|
|Min. pad diameter with hole||14mil( 0.15mm drilling)||12mil( 0.1mm laser)|
|Min. BGA pad diameter||10mil||8mil|
|Chemical ENIG gold thickness||0.025-0.1um(1-4U)||0.025-0.1um|
|Chemical ENIG nickel thickness||3-5um(120-200U)||3-5um|
|Min. resistance test||Ω||5|
|Max. insulation resistance test||MΩ||250|
|Tolerance of dimension size||+/-0.13mm||+/-0.1mm|
|Tolerance of board thickness||>=1.0mm +/-10%||+/-8%|
|Tolerance of finished NPTH hole size||+/-0.05mm||+/-0.05mm|
|Tolerance of finished PTH hole size||+/-0.076mm||+/-0.05mm|
|CAM capability||20 Items|
|Copper wire peet-off strength||=7.8N/cm|
|Insulting layer thickness test(min.)||0.05(limit to HOZ base copper or residual copper rate up to 1OZ
|Resistance to soldering heat test||288℃/10S/3 times|
|solderability test||99.9% pad wetting|
Total scrap rate ≦ 1.8% customer satisfaction≧90%
Template punctuality delivery rate ≧ 98%
batch punctuality delivery rate ≧ 92%
Customer complaint rate ≦ 1% customer return rate ≦ 0.5%
Comprehensive Qualified rate ≧ 98%
batch board utilization ≧ 90%
Pre-launch rate: ≦ 3% backwash solder mask ≦ 3%, circuit ≦ 2.5%
1. 13 years professional PCB/PCBA manufacturing experience.
Specializing in electronics manufacturing service including
electronic design and engineering, PCB Fabrication & Assembly,
SMT, custom printed circuit board products, One-stop cost-effective
PCB Solutions, Electronic Components Procurement, prototyping,
turnkey solution and other value-added service.
2. Excellent and high process capability,
Specialized in 2 to 32 layer PCBs, FR4, Ceramic, High TG, Rogers,
High Frequency RF, Halogen free, Aluminum-based PCB etc. available,
with 3mil minimum line width and spacing and as small as 0.2mm
holes. Copper thickness is 1 to 6oz on the inner layer and 0.5 to
5oz on the outer layer.
3. International quality & environment certifications.
GX quick has been certificated by international quality &
Environment systems such as ISO9001, ISO14001, SGS, RoHS, UL etc.
4. A large number of advanced equipment imported from the United
States, Japan, Germany, Israel .
Sophisticated equipment is gradually introduced to ensure excellent
manufacturing process capabilities, such as:
1) Drilling machine
2) Full automatic plating line
3) Drawing and electricity automatic line
4) Punching machine
5) Digital control routing machine
7) Antioxidant treatment line
8) Full automatic digital control V-CUT machine
10) AOI testing machine
11) CCD-Exposal room
12) Automatic dry film machine
13) High speed flying probe machine
14) Fully automatic temperature control baking ovens.
15) Dedicated testing machine
5. Free samples with sample costs refunded after confirmed standard
order, 24-hour quick-turn service.
6. High quality raw materials from top suppliers for laminates,
copper foil, PP and more.
Package: PE + Cartoon
- Finished Board
- Packed in anti-static bag
- Bubble pack
- Packed in cartoon
- Packed in strap
1) Strict clients PCB requirements complying and modification
2) FIFO and efficient incoming materials inspection.
3) Regular vendors audit and performance analysis.
4) Specs tag along with boards during production.
5) 100% AOI and E-test.
6) Inspections including high voltage, impedance control, soldering
ability, thermal& shocking test, insulating resistance and
ionic cleanliness testing.
7) Micro-section analysis and testing report.
8) RMA and refund policy.