SMT Line Machine BGA Rework Station Black Repair machine From CN
1. Integrated design of hot air head and mounting head, with
automatic placement automatic welding and automatic disassembly.
2. The top wind picking hot air system is characterized by rapid
temperature rise, uniform temperature, and rapid cooling (down from
50 to 80 degrees when cooling down), which better meets the
technological requirements for lead-free welding. In the lower heat
zone, infrared and hot air are used to heat the mixture. Infrared
radiation directly acts on the heating zone and is conducted
simultaneously with the hot air. This can make up for the lack of
each other, allowing the PCB to warm up quickly (heating rate up to
10°C/S), while maintaining the temperature evenly.
3, independent three temperature zone (upper temperature zone,
lower temperature zone, infrared preheating zone), the upper
temperature zone and the lower temperature zone realize synchronous
automatic movement, can automatically reach the bottom infrared
preheating zone any position, the lower temperature zone can be
Moving up and down, supporting the PCB, using the motor to
automatically control, realize that the PCB does not move on the
fixture, and the upper and lower heating heads can be integrally
moved to the target chip of the PCB.
4. The PCB card board adopts high-precision sliders to ensure the
accuracy of BGA and PCB board placement.
5. The original bottom preheating platform adopts imported German
excellent heat-generating material (infrared gold-plated light
pipe) anti-glare thermostat glass (temperature resistance up to
1800°C) to preheat the area up to 500×420mm
6. The preheating platform, plywood device and cooling system can
be moved in the X direction as a whole, making the PCB positioning
and folding welding more safe and convenient.
7. X, Y adopts automatic motor control and movement mode, which
makes the position alignment faster and more convenient. The
equipment space is fully utilized and the large surface is achieved
with a relatively small device volume.
8, double rocker control, alignment lens and heating platform above
and below, in order to ensure alignment accuracy.
9, built-in vacuum pump, φ angle rotation, precision fine-tuning
10. The suction nozzle automatically recognizes the suction and
mounting height, the pressure can be controlled within a tiny range
of 10g, and it has 0 pressure suction and mounting functions,
aiming at smaller chips.
11, color optical vision system with manual X, Y direction
movement, with split two-color, zoom and fine-tuning function,
including color difference resolution device, auto focus, software
operation, 22 optical zoom, can repair the largest BGA size 80×80
12, 10 paragraphs of rising (falling) temperature + 10 constant
temperature control, mass storage mass curve, curve analysis can be
performed on the touch screen.
13, a variety of sizes of alloy hot air nozzle, easy to replace,
360 ° rotation positioning.
14, configure 5 temperature ports, with multi-point real-time
temperature monitoring and analysis capabilities.
15. With solid state operation display function, the temperature
control is more safe and reliable.
16. The machine can automatically generate SMT standard temperature
disassembly curves at different temperatures in different regions.
It does not need to manually set the machine curve, and can be used
by experienced operators to achieve machine intelligence.
|The largest PCB size||W650×D610mm|
|Applicable PCB thickness||0.5-4mm|
|Applicable chip size||1×1-80×80mm|
|Applicable chip minimum pitch||0.15mm|
|Mounting maximum load||500g|
|PCB positioning method||Shape or positioning hole|
|Temperature control method||K-type thermocouple, closed-loop control|
|Lower hot air heating||Hot air 1200W|
|Upper hot air heating||Hot air 1200W|
|Bottom infrared preheat||Infrared 5000W|
|using electric||AC 220V, 50/60Hz|
|Machine size||L970×W700×H830mm (without bracket)|
|Machine weight||About 140KG|
|Exterior color||Milky white|