Polyamide Hot Melt Adhesive DY-P403 Used In Bonding Material For
Package , Textile , Plastic , Metal Etc.
|Acid Value,(mg KOH/g ≤)||5|
|Amine Value,(mg KOH/g≤)||3|
|Tensile Strength, (≥ MPa)||13|
|Water absorption, (≤ %)||0.4|
|Shear Strength, (≥ MPa, AL/AL)||10|
|Stretch Rate, (≥ %)||250|
|Operating Temperature( ºC )||190-200|
Yellowish round granule
DY-P403 is made from dimer acid and polyamine through condensation
reaction, it has higher performance.
DY-P403 can dissolve in general organic solvents, the hot-melting
viscosity of the resin is greatly related to the temperature that
Excellent properties such as lower viscosity, good fluidity, good
flexibility, high adhesive strength, good media corrosion
resistance, good solubility and fluxing property at low
temperature, higher heat stability etc.
Heat-shrinkable sleeve for electric cable, sealing material for
electrical connection, cementing or fixing materials for electronic
component, bonding material for package, textile, leather, wood,
plastic, metal and ceramics etc.
Packaging and Storage:
craft paper-plastic composite bag;
25Kgs per bag.
Kept in cool, airy and dry place;
Keep the package sealed before using up.