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Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

Categories Thermal Conductive Pad
Brand Name: ZIITEK
Model Number: TIF™500 Series
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 days
Packaging Details: 1000pcs/bag
Tensile Strength: 40 psi
Thermal conductivity: 2.6 W/m-K
Hardness: 35 Shore 00
Specific Gravity: 2.80 g/cc
Dielectric Constant: 10.2 MHz
Fire rating: 94-V0
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Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc


The TIF™500 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF™500 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.



Features:

> Good thermal conductive: 2.6 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)


Typical Properties of TIF™500 Series
Color

Violet

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
35 Shore 00ASTM 2240

70mils / 1.778 mm

1.05

80mils / 2.032 mm

1.15

Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

1.25

100mils / 2.540 mm

1.34

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.43

120mils / 3.048 mm

1.52

Dielectric Breakdown Voltage
>10000 VACASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
10.2 MHzASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
7.8X10" Ohm-meterASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14

200mils / 5.080 mm

2.22

Thermal conductivity
2.6 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Quality Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc for sale
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